Chip Technology

Deals/Contracts/Partnerships

EIIR Provider Solutions/Capabalities

• 1

  First 5G IoT Chip Combining Design in India and Make in India capabilities by Cyient, IIT H, and WiSig Networks

  Q2(Apr-May-Jun), 2022

• 2

  Siemens has collaborated with United Microelectronics Corporation (UMC) to develop process design kits (PDKs) for the foundry‘s 110-nanometer (nm) and 180-nm BCD technology platforms.

  Q1(Jan-Feb-Mar), 2022

• 3

  Ansys Collaborates with TSMC to Deliver Thermal Analysis Solution for 3D-IC Designs

  Q4(Oct-Nov-Dec), 2021

• 4

  Siemens collaborates with TSMC on EDA tool certifications for TSMC’s advanced technologies

  Q4(Oct-Nov-Dec), 2021

• 5

  Ansys Multiphysics Solutions Achieve Certification for Samsung’s 3nm and 4nm Process Technologies

  Q4(Oct-Nov-Dec), 2021

• 6

  Imagination’s HyperLane technology and Mobica’s application and design expertise to enhance automotive display performance and safety.

  Q4(Oct-Nov-Dec), 2021

EIIR Buyer GIC/R&D Best Practices/Solutions

• 1

  South Korean startup Rebellions releases ATOM chip to challenge Nvidia?s AI chip

  Q1(Jan-Feb-Mar), 2023

• 2

  Eight major Japanese tech firms and car makers, including Kioxia, NEC, NTT, SoftBank, Sony and Toyota, are teaming up in a consortium to launch an advanced chip maker. Rapidus. The Japanese government? will back Rapidus with ~$500 million while each parti

  Q4(Oct-Nov-Dec), 2022

• 3

  MediaTek's first SoC for VR will power Sony's upcoming PlayStation VR2

  Q4(Oct-Nov-Dec), 2022

• 4

  IMEC signed a cooperation agreement with new Japanese venture Rapidus for production of 2 nm process semiconductor chips

  Q4(Oct-Nov-Dec), 2022

• 5

  TSMC starts production of advanced chips with 3nm technology in Taiwan.

  Q4(Oct-Nov-Dec), 2022

• 6

  Samsung Is First to Start Mass Production of 3-Nanometer Chips. Beats close competitor TSMC to next stage of chip fabrication.

  Q3(Jul-Aug-Sep), 2022

• 7

  Apple Is Setting Up a New R&D Centre In Jerusalem. It will be the third of its kind addition to its centers in Herzliya and Haifa. It will focus on Apple?s M processors used in Mac desktops and notebooks.

  Q3(Jul-Aug-Sep), 2022

• 8

  Samsung Electronics broke ground at a new semiconductor R&D complex in South Korea, where it plans to invest about $15 billion by 2028 to drive leadership in chip technology.

  Q3(Jul-Aug-Sep), 2022

• 9

  AMD Singapore expands its R&D footprint toward driving next-generation HPC products and capabilities. AMD will invest more than US$50M to expand and upskill the workforce in Singapore and upgrade capabilities over the next 3 years.

  Q3(Jul-Aug-Sep), 2022

• 10

  Swiss silicon nitride photonic integrated circuits (PICs) company LIGENTEC SA says it has set up a research and development (R&D) center in France. The center?s PIC development expertise will extend end to end, from design and wafer processing to characterization, with access to advanced on-premises equipment.

  Q2(Apr-May-Jun), 2022

• 11

  TSMC to move forward with the 1.4nm process to get a lead on its competitors.

  Q2(Apr-May-Jun), 2022

• 12

  Samsung Electronics succeeded in developing the world’s first in-memory computing architecture that can run computer calculations using only memory chips without the need of separate processors. It can significantly reduces overall energy consumption.

  Q1(Jan-Feb-Mar), 2022

• 13

  Infineon’s CoolSiC power module reduces energy consumption of streetcars by ten percent

  Q1(Jan-Feb-Mar), 2022

• 14

  New AMD Radeon PRO W6000 Series Graphics Unleash High-Efficiency, Powerful CAD Performance for Mainstream Workstation Users

  Q1(Jan-Feb-Mar), 2022

• 15

  Ambarella Launches AI Domain Controller SoC Family for Single-Chip Multi-Sensor Perception, Fusion and Path Planning in ADAS to L4 Autonomous Vehicles

  Q1(Jan-Feb-Mar), 2022

• 16

  Applied Materials unveiled a unique eBeam metrology system that enables a new playbook for patterning control based on massive on-device, across-wafer and through-layer measurements.

  Q1(Jan-Feb-Mar), 2022

• 17

  US-based semiconductor company Ceremorphic recently set up its India Development Centre in Hyderabad. Currently employing 140 people, the company by the end of 2024 plans to employ 400 people at this centre. Designed in advanced silicon geometry (TSMC 5nm premier node), this new architecture has been built from the ground up to solve today?s high-performance computing problems to serve all high demanding market segments such as artificial intelligence / machine learning, high power computing, automotive processing, drug discovery, and metaverse processing.

  Q1(Jan-Feb-Mar), 2022

• 18

  Vodafone has teamed up with Intel Corp and other silicon vendors to design its own chip architecture for nascent OpenRAN network technology, aiming to weaken the grip of traditional telecoms equipment suppliers.

  Q1(Jan-Feb-Mar), 2022

• 19

  Intel is setting up a GPU development center in the UK. A brand-new team in the UK to focus solely on class-leading low power GPU architectures and designs to enable the next generation of portable computing.

  Q1(Jan-Feb-Mar), 2022

• 20

  Lam Research Introduces Groundbreaking Suite of Selective Etch Tools to Accelerate Chipmakers? 3D Roadmaps. To keep pace with Moore?s Law, chipmakers are now developing transistor structures vertically ? an exceptionally complex process that requires ultra-high selectivity, precision etching and uniform isotropic removal of material without modifying or causing damage to other critical material layers.

  Q1(Jan-Feb-Mar), 2022

• 21

  Mobix Labs, a connectivity solutions provider for wireless mmWave 5G and wired high bandwidth cable networks, has opened a new design center in Sydney, Australia.

  Q4(Oct-Nov-Dec), 2021

• 22

  Gallium Semiconductor to open European R&D centre in Nijmegen, Netherlands.

  Q4(Oct-Nov-Dec), 2021

• 23

  SKC, a part of South Korean conglomerate SK Group, will build a 12,000 square metre production plant in Georgia, U.S. SKC is starting to commercialise high-performance computing glass substrate that it has developed. Glass substrate is described as a futuristic material that is considered a 'game changer' in the semiconductor packaging field as it can significantly increase the performance and power efficiency of computer chipsets.

  Q4(Oct-Nov-Dec), 2021

• 24

  AMD Announces Ambitious Goal to Increase Energy Efficiency of Processors Running AI Training and High Performance Computing Applications 30x by 2025

  Q4(Oct-Nov-Dec), 2021

• 25

  MediaTek and TSMC Unveil the World’s First 7nm 8K Resolution Digital TV System-on-Chip

  Q4(Oct-Nov-Dec), 2021

• 26

  Huawei may launch its self-developed 5G chipset for flagship phones

  Q4(Oct-Nov-Dec), 2021

• 27

  IBM and Samsung Unveil Semiconductor Breakthrough That Defies Conventional Design utilizing a new vertical transistor architecture that demonstrates a path to scaling beyond nanosheet, and has the potential to reduce energy usage by 85 percent.

  Q4(Oct-Nov-Dec), 2021

• 28

  IBM unveiled details of the upcoming new IBM Telum Processor, designed to bring AI inference to enterprise workloads to help address fraud in real-time.

  Q3(Jul-Aug-Sep), 2021

• 29

  Codasip, the leading supplier of customisable RISC-V processor IP, announced that it is opening Design center in UK and is looking to hire over 100 engineers.

  Q3(Jul-Aug-Sep), 2021

• 30

  IBM Unveils World's First 2 Nanometer Chip Technology, Opening a New Frontier for Semiconductors

  Q2(Apr-May-Jun), 2021

• 31

  TSMC will establish a semiconductor R&D base in Tsukuba, Japan. The ministry will provide 19 billion yen in subsidies, more than half of the project’s cost of 37 billion yen. The center will focus on semiconductor packaging. About 20 Japanese chipmakers such as Hitachi High-Tech and Asahi Kasei are planning to collaborate with TSMC.

  Q2(Apr-May-Jun), 2021

• 32

  Apple is planning to establish a new European semiconductor design center in Munich, Germany, as part of a 1 billion-euro ($1.2 billion) investment push over the next three years to expand its team there and develop custom chips for 5G mobile and other wireless technologies. It will be Apple’s largest R&D site for mobile wireless semiconductors and software and it plans to hire hundreds of people.

  Q1(Jan-feb-Mar), 2021

• 33

  Intel CEO Pat Gelsinger Announces ‘IDM 2.0’ Strategy for Manufacturing, Innovation and Product Leadership. Intel is doubling down on manufacturing in US. It plans to spend $20 billions on new factories in Arizona and create a foundry business.

  Q1(Jan-feb-Mar), 2021

• 34

  Microchip Technology to invest $20m in Cork development center. This new facility will incorporate an engineering lab and extend Microchip’s regional customer support. Initially, the development center will focus on mixed-signal integrated circuit design, applications and software development for high-speed networking, timing and synchronization products, high voltage power management devices and solutions, high reliability integrated power systems and FPGA.

  Q1(Jan-feb-Mar), 2021

• 35

  Microsoft doing chips R&D in Israel.

  Q1(Jan-feb-Mar), 2021

• 36

  Qualcomm acquires Nuvia for $1.4 billion and accelerating successful partnerships with OS providers for next-generation computing devices. All technology providers in mobile, devices, auto are happy with this acquisition.

  Q1(Jan-feb-Mar), 2021

• 37

  TSMC plans to build a $189M research development center in Ibaraki Prefecture, northeast of Tokyo. The center will focus on advanced semi packaging and testing, and the company could install a local production line to add capacity.

  Q1(Jan-feb-Mar), 2021

• 38

  German RISC-V core designer Codasip has opened a strategic design centre in France for its processor cores based on teh open source RISC_V instruction set architecture (ISA). The centre in Villeneuve Loubet is near Sophia Antipolis where major technology companies such as Bosch, NXP, Thales, and many others have offices.

  Q4(Oct-Nov-Dec), 2020

• 39

  Huawei plans to build a chip plant in Shanghai without using American technology. The fabrication facility is expected to start with the manufacture of low-end 45nm chips, and later 28nm and 20nm chips.

  Q4(Oct-Nov-Dec), 2020

Other News

• 1

  Lockheed Martin, Ayar Labs Partner To Advance Microchip Connectivity For Next Generation Sensory Systems

  Q4(Oct-Nov-Dec), 2022

• 2

  AMD Expands Data Center Solutions Capabilities with Acquisition of Pensando for $1.9 Billion

  Q2(Apr-May-Jun), 2022

• 3

  Intel has acquired Siru Innovations, a Finnish technology company specializing in the development of graphics IP and software services. Siru adds critical GPU talent that will support Intel?s pursuit of leadership graphics IP.

  Q2(Apr-May-Jun), 2022

• 4

  Ethereum miners spent $15 billion on GPUs in the last two years about 10% of total GPU supply.

  Q2(Apr-May-Jun), 2022

• 5

  Intel buys Tower Semiconductor for $5.4 billion to expand its foundry business on specialty products like radio frequency (RF) chips, CMOS image sensors, and power management parts.

  Q1(Jan-Feb-Mar), 2022

• 6

  Sony to join TSMC on a $7 billion chip plant in Japan. 50% funding is by the Japanese Government.

  Q4(Oct-Nov-Dec), 2021

• 7

  Bosch to invest more than 400 million euros in its semiconductor fabs in 2022

  Q4(Oct-Nov-Dec), 2021

• 8

  Samsung has picked Taylor, Texas as the location for a new $17-billion plant to make advanced chips.

  Q4(Oct-Nov-Dec), 2021

• 9

  Texas Instruments to begin construction next year on new 300-mm semiconductor wafer fabrication plants in Sherman Texas

  Q4(Oct-Nov-Dec), 2021

• 10

  Intel announced that it could invest as much as EUR 80 billion in Europe over the next decade to boost chip capacity.

  Q3(Jul-Aug-Sep), 2021

• 11

  Infineon opens high-tech chip factory for power electronics on 300-millimeter thin wafers

  Q3(Jul-Aug-Sep), 2021

• 12

  AMD overtakes Intel in desktop CPU market share for the first time in 15 years.

  Q1(Jan-feb-Mar), 2021

• 13

  Germany’s Bosch to open automotive chip factory in June.

  Q1(Jan-feb-Mar), 2021

• 14

  Indian Government released an Expression of Interest inviting companies/ consortia desirous of A. Either setting up / expansion of existing Semiconductor wafer / device fabrication (FAB) facilities in India or B. Or Acquisition of Semiconductor FABs outside India.

  Q4(Oct-Nov-Dec), 2020

• 15

  Vietnam requests Samsung to make investment in semiconductors.

  Q4(Oct-Nov-Dec), 2020

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